India is shifting its semiconductor ambitions from basic chip production to cutting-edge manufacturing, targeting 3 nanometre (nm) chip production by 2032 and progressing toward 2 nm in the early 2030s as part of its Semicon 2.0 roadmap, Union Minister Ashwini Vaishnaw said. The plan aims to bolster domestic manufacturing and design capabilities and expand support for startup chip designers under the Design Linked Incentive (DLI) scheme.
The initiative focuses on six key chip categories, including compute, radio frequency (RF), networking, power management, sensors and memory, critical for modern electronics across defence, communications and consumer products. Officials also hope to increase the number of fabless startups in India as part of building a robust semiconductor ecosystem.
India’s chip ambitions highlight the country’s growing role in advanced tech, balancing innovation with strategic policy considerations.
